IEEE AP-MTT Chapter Presents:
“Fully Integrated CMOS Radios for Broadband Wireless Devices: Challenges and Solutions”
By
Dr. Seok-Bae (Michael) Park
Firstpass Technologies, Inc., Dublin, Ohio
Date: 2:00-3:00PM, Thursday, October 2nd , 2008
Place: ElectroScience Laboratory, 1320 Kinnear Rd, Columbus, OH 43212
Title:
“Fully Integrated CMOS Radios for Broadband Wireless Devices: Challenges and Solutions”
Abstract:
This talk will address some of the key challenges in designing low power low cost fully integrated CMOS RFIC front ends for wireless broadband applications. A key challenge in emerging MIMO platforms is the front end module which represents a major bottleneck for the total cost of the solution. Examples are found in today’s high data rate 802.11n WLANs, in mobile WiMAX and in cellular super 3G or LTE (Long Term Evolution). To address this challenge a design for an on chip T/R switch is presented. Its performance compares favorably with that of off-the-shelf switch. It occupies only 0.7 mm2.
Another key challenge is the design of mixed signal baseband chains for a direct conversion radio. The I-Q receive and transmit chains tend to occupy a significant portion of the total area (25 to 40%) of a radio solution. To address this challenge, we present a new methodology for designing a compact radio where the mixed signal chain is shared between receive and transmit chains.
Thirdly, in designing broadband radios for OFDM non-constant envelope modulation, highly linear mixer design is needed. Here we present a novel mixer design intended for use in an enhanced data rate (EDR V.2.1) Bluetooth solution where linearization techniques are adopted to meet the stringent linearity requirements imposed on the radio.
The design examples discussed in this talk demonstrate the potential success of CMOS in building highly complex radios specially in emerging nanometer technologies for broadband and for integrated mm-wave (60GHz and beyond) RFIC applications.
Short Bio:
Seok-Bae (Michael) Park received the B.S. and M.S. degrees in Electrical Engineering from Seoul National University, Seoul, Korea, and the M.S. and Ph.D. degrees in Electrical and Computer Engineering from Ohio State University, Columbus, Ohio.
He is currently with Firstpass Technologies, Inc., Dublin, Ohio as a Senior RF and Mixed-Signal Design Engineer. His current interests include low voltage/low power CMOS RF/analog/mixed-signal integrated circuits and systems for wireless communications. He has a number of publications in prestigious international journals and conference proceedings and has applied for one US patent.
