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« Friday February 06, 2009 »
Fri
Start: 2:00 pm
End: 3:00 pm

IEEE AP-MTT Chapter Presents:

“Integrated power management units for wireless applications”
By
Wei Liu
Ohio State University

Date: 2:00-3:00PM, Friday February 6th, 2009

Place: ElectroScience Laboratory, 1320 Kinnear Rd, Columbus, OH 43212

Title: “Integrated power management units for wireless applications”

Abstract:
With the advancement of technology, wireless communications now facilitate
our daily lives from entertainment to business, from work to pastime.
However, the demands for longer battery runtime from customers conflict
with the slow-paced development of better battery technology. As a result,
design of integrated power management units for wireless applications is
becoming a critical issue for the new generation wireless applications
which combine the integrated business such as voice, multimedia and data.
In this talk, I will first summarize the categories band structures of
integrated power management units. Then I will emphasize the implementation
of integrated power management units especially low drop-out voltage
regulator (LDO) and introduce a new structure to low drop-out voltage
regulator. This structure is based on using a transimpedance amplifier as
the error amplifier in traditional structure of low drop-out voltage
regulator. The bulky off-chip external capacitor at the output of
traditional low drop-out voltage regulator can be removed in the new
structure. Therefore, it is very attractive to be an integrated power
management unit for the new generation wireless applications. I will also
outline the design and summarize the performance of the new structure low
drop-out voltage regulator. In conclusion, I will briefly review today's
content with a small discussion on the future design challenges on this new
structure low drop-out voltage regulator.

Short Bio:
Wei Liu was born in Xi'an, China in 1976. He received his BSc. degree in
1998, Msc. degree in 2001 all in Electrical engineering from Xi'an
Jiaotong University, China. He was an ASIC design engineer from 2001 to
2003 in Zhongxing Corporation, China and an analog integrated circuit
design engineer from 2003 to 2007 in Samsung Electronics, Korea. In
September 2007, he joined the Department of Electrical and Computer
Engineering at Ohio State University as a Ph.D. student. His research areas
include analog and mixed-signal integrated circuit design and integrated
power electronics.

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